Electromechanical product development is about to get easier and faster than ever, thanks to the innovative strategic partnership between Cadence and Dassault Systèmes. These two global leaders in PCB and mechanical design software have been working closely together to integrate their best-in-class tools on the 3DEXPERIENCE product development platform.
As Cadence’s new Allegro X and OrCAD X PCB design solutions share their product design, manufacturing, and management data with the cloud-enabled 3DEXPERIENCE Platform, PCB design teams will be able to seamlessly collaborate with mechanical and electrical teams.
The Platform’s end-to-end portfolio of processes and solutions – including MBSE, multi-CAD development, EBOM-to-MBOM, multiphysics simulation, configuration management, virtual factory , and so much more – will be critical for Cadence customers as they attempt to conquer future development challenges effectively, affordably, and on time.
GoEngineer is proud to be a leading joint partner of both Cadence and Dassault Systèmes. Reach out today to learn more about this upcoming Cadence- 3DEXPERIENCE integration, slated for release in Q2 2024. For desktop SOLIDWORKS, discover the traditional Cadence-SOLIDWORKS connector – available now – here:
PCB designers can also take advantage of high-end electromagnetic simulation with CST Studio Suite from Dassault Systèmes. Since 2022, GoEngineer customer Inovonics has been using 3DEXPERIENCE cloud compute to accelerate their emag analyses without buying expensive enterprise servers.
This is only the beginning of an exciting future for collaborative mechatronic product development.
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About Zack Yates
Zack Yates is GoEngineer's Software Product Marketing Manager based out of Ann Arbor, MI. He comes to the position after many years as a consulting CAE Analyst with a focus on Abaqus. He has a degree in music from the University of Michigan and loves to be creative, learn new things, and travel the world.
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